Ralph Bond
After a long career in high tech, including with Inte, and then the last 10 years of my full-time career with Autodesk, I'm now "retired" and enjoy being the Science and Technology Trends correspondent for Computer America and Into Tomorrow,
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Deep insights for the chip industry. semiengineering.com Hot topics: semiconductor, EDA, advanced packaging, hardware, low power, HPC, hardware security, automotive chips, embedded, edge computing, semiconductor manufacturing, chip design, VLSI
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